​​Mobiveil Inc. (a GlobalLogic company)​

Mobiveil Inc. (a GlobalLogic company) (a Hitachi Group Company) is a Silicon and Hardware Engineering leader specializing in Silicon IP (SIP), application platforms, and engineering services for Flash Storage, 5G, AI/ML, Data Centers, Automotive, and Industrial IoT.

Mobiveil’s core strengths include Silicon-Proven IPs such as PSRAM, ApSRAM, xSPI, ONFI, LDPC (Flash & Wireless), NVMe, DDR, LPDDR, UFS, Unipro, HyperRAM, HyperBus, Serial RapidIO, AXI, and more. Its engineering services span ASIC, FPGA, SoC Design, Embedded Software Development, High-Speed Board & PCB Design, RTL to GDSII, ASIC Tester Platform Solutions, FPGA Prototyping & Emulation Platforms as well as Generative AI and Data Engineering Services.

Technical features & advantages that customers will look for:

• Silicon-Proven IP Portfolio: Extensive library of high-speed interface IPs including PSRAM, ApSRAM, xSPI, ONFI, LDPC (Flash & Wireless), NVMe, DDR, LPDDR, UFS, Unipro, HyperRAM, HyperBus, Serial RapidIO, and AXI Controllers—optimized for performance, power, and interoperability.
• End-to-End ASIC/FPGA/SoC Services: Expertise across the complete silicon lifecycle—from RTL design, functional verification (UVM/SV), DFT, STA, and physical design (RTL2GDSII) to post-silicon validation and bring-up, enabling first-time-right silicon for complex SoCs.
• Custom ASIC Tester Solutions and FPGA Platforms: Development of customized ASIC-based testers, Gen5 SSD validation platforms, and AI/ML FPGA accelerators. Also supports FPGA-based emulation platforms for early hardware/software integration and verification.
• Embedded Software, GenAI & Data Engineering: Full-stack capabilities including device drivers, bootloaders, BSPs, real-time OS, and now GenAI model integration for intelligent embedded systems, along with data engineering services for processing, analytics, and scalable AI deployment across edge and cloud platforms.
• Advanced Board, Mechanical, and System Design: End-to-end design of multi-layer high-speed PCBs, SI/PI analysis, board bring-up, and complete mechanical design, including 3D modeling and thermal solutions for production-grade systems in compute, storage, automotive, and telecom applications.